Device

ABSTRACT

A semiconductor device has a first controlled chip, including a first replica output circuit having the same configuration as a first output circuit, a first ZQ terminal connected to the first replica output circuit, a first through electrode connected to the first ZQ terminal, and a first control circuit which sets the impedance of the first replica output circuit. A control chip includes a second ZQ terminal connected to the first through electrode, a comparator circuit which compares a voltage of the second ZQ terminal with a reference voltage, and a second control circuit  123  which performs a process based on a comparison by the comparator circuit. The first control circuit and the second control circuit receive a common input signal to operate and sequentially change and set the impedance until the comparison result changes when an external resistance element is connected to the second ZQ terminal.

This application claims priority to prior Japanese application JP2011-228069, the disclosure of which is incorporated herein byreference.

BACKGROUND OF THE INVENTION

The present invention relates to a semiconductor device including aplurality of chips, and more particularly to a semiconductor devicehaving a calibration circuit operable to adjust an impedance of anoutput circuit.

There has been known a calibration circuit connected to a ZQ terminal asone of external terminals of a semiconductor device. The calibrationcircuit adjusts the impedance of an output circuit connected to anotherexternal terminal, such as a DQ terminal, with use of an externalresistance element connected to the ZQ terminal. For example, JP-A2011-101143 discloses this type of circuit at FIG. 1.

There also has been known a semiconductor device having a plurality ofsemiconductor chips stacked together. The semiconductor chips areelectrically connected to each other by through electrodes (throughsilicon vias; TSVs) extending through each of the semiconductor chips.For example, JP-A 2011-029535 discloses this type of semiconductordevice at FIG. 4.

SUMMARY

In a semiconductor device including a plurality of semiconductor chipsstacked together and electrically connected to each other by throughelectrodes, the distance between an external terminal of thesemiconductor device and each of the semiconductor chips (an internalwiring length including through electrodes) varies depending upon thestacked location of the semiconductor chip. Therefore, even if anexternal resistance element having a predetermined resistance value isconnected to one of external terminals of the semiconductor device, itseems to each of the semiconductor chips that a resistance elementhaving a different resistance value is connected to the semiconductorchip. Accordingly, if a calibration circuit of each of the semiconductorchips performs an impedance adjustment (calibration) on an outputcircuit of the semiconductor chip with use of the resistance elementconnected to the external terminal of the semiconductor device, then theobtained impedance is deviated from a proper value by an amountcorresponding to its wiring length (the resistance value of the throughelectrodes). Specifically, each of the impedances of the semiconductorchips is not exactly matched with the resistance value of one externalresistance element. Furthermore, the impedances of the semiconductorchips differ from each other.

Similarly, in a case of performing a calibration operation on eachsingle one of semiconductor chips, then stacking those semiconductorchips together, and connecting those semiconductor chips to each othervia through electrodes, the output impedances of the semiconductor chipsas seen from the external terminal of the semiconductor device differfrom each other.

Such variations in output impedance of the semiconductor chips inhibit ahigh-speed operation of the semiconductor device and also causegeneration of a transmission error of a signal.

The present invention seeks to solve one or more of the above problems,or to improve upon those problems at least in part.

In one embodiment, there is provided a device that includes a firstcontrolled chip and a control chip operable to control the firstcontrolled chip. The first controlled chip is stacked on the controlchip. The first controlled chip includes a first output circuit, a firstreplica output circuit having the same configuration as the first outputcircuit, a first ZQ terminal electrically connected to the first replicaoutput circuit, a first through electrode connected to the first ZQterminal and extending through the first controlled chip, and a firstcontrol circuit operable to set an impedance of the first replica outputcircuit. The control chip includes a second ZQ terminal connected to thefirst through electrode, a comparator circuit operable to compare avoltage of the second ZQ terminal with a reference voltage, a secondcontrol circuit operable to perform a process according to a comparisonresult from the comparator circuit, and a DQ input/output circuitoperable to receive date from and transmit data to the first outputcircuit. The first control circuit and the second control circuitreceive a common input signal to operate, adjust the impedance of thefirst replica output circuit according to the comparison result in astate in which an external resistance element is connected to the secondZQ terminal, and set the adjusted impedance to the first output circuit.

BRIEF DESCRIPTION OF THE DRAWINGS

The above features and advantages of the present invention will be moreapparent from the following description of certain preferred embodimentstaken in conjunction with the accompanying drawings, in which:

FIG. 1 is a block diagram showing an outlined configuration of asemiconductor device according to an example of the technical concept ofthe present invention;

FIG. 2 is a block diagram showing an example of an internalconfiguration of a controlled chip used in a semiconductor deviceaccording to a first embodiment of the present invention;

FIG. 3 is a diagram showing an outlined configuration of a semiconductordevice according to the first embodiment of the present invention;

FIG. 4 is a block diagram showing an outlined internal configuration ofa logical LSI chip and SDRAM chips in the semiconductor device of FIG.3;

FIG. 5 is a diagram explanatory of a calibration circuit in a relatedsemiconductor device;

FIG. 6 is a diagram explanatory of a primary portion of thesemiconductor device according to the first embodiment of the presentinvention;

FIG. 7 is a diagram explanatory of a chip selection circuit included inthe semiconductor device of FIG. 6;

FIG. 8 is a waveform chart explanatory of an operation of the chipselection circuit of FIG. 7;

FIG. 9 is a diagram explanatory of an internal configuration of areplica output circuit and a control circuit included in thesemiconductor device of FIG. 6;

FIG. 10 is a flow chart explanatory of a calibration operation in thesemiconductor device of FIG. 6;

FIG. 11 is a diagram explanatory of transmission of a control code to animpedance adjustment circuit of each of semiconductor chips in thesemiconductor device of FIG. 6;

FIG. 12 is a waveform chart explanatory of transmission of a controlcode to the impedance adjustment circuits of all of the semiconductorchips in the semiconductor device of FIG. 6;

FIG. 13 is a block diagram showing an example of an informationprocessing system using the semiconductor device of FIG. 6; and

FIG. 14 is a block diagram showing another example of the informationprocessing system using the semiconductor device of FIG. 6.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

A typical example of the technical concept of the present invention forsolving problems in the prior art will be shown below. The presentinvention is not limited to the illustrated technical concept and shouldbe defined by claims of the present application.

FIG. 1 is a block diagram showing an outlined configuration of asemiconductor device 100 according to a typical example of the technicalconcept of the present invention.

In the semiconductor device 100, a comparator circuit 122 required for acalibration operation is separated from a first controlled chip 110including a first replica output circuit 111 with respect to a second ZQterminal 121-1 of a control chip 120, to which an external resistanceelement 130 is connected.

The semiconductor device 100 includes a first controlled chip 110, othercontrolled chips 110-1, and a control chip 120 on which the firstcontrolled chip 110 is stacked along with the other controlled chips110-1. Since the other controlled chips 110-1 have the sameconfiguration as the first controlled chip 110, the order of stackingthe controlled chips does not matter.

The first controlled chip 110 has a first output circuit (not shown) anda first replica output circuit 111 having the same configuration as thefirst output circuit. The first controlled chip 110 also has a first ZQterminal 112 connected to the first replica output circuit 111, a firstthrough electrode 113 connected to the first ZQ terminal 112, and afirst control circuit 114 operable to set the impedance of the firstreplica output circuit 111. The first ZQ terminal 112 and the firstthrough electrode 113 are formed so as to have the same electricalcharacteristics as a data terminal connected to the first output circuitand a through electrode connected to that data terminal.

The control chip 120 has a second ZQ terminal 121-1, a comparatorcircuit 122 connected to the second ZQ terminal 121-1, and a secondcontrol circuit 123. The second ZQ terminal 121-1 is connected to thefirst through electrode 113 of the first controlled chip 110 via otherthrough electrodes formed in the other controlled chips 110-1. Thecomparator circuit 122 is operable to compare a voltage of the second ZQterminal 121 with a reference voltage Vref. The second control circuit123 is operable to perform a process according to comparison resultsfrom the comparator circuit 122. The control chip 120 also has anexternal terminal 121-2 connected to the second ZQ terminal 121-1. Theexternal terminal 121-2 can be regarded as substantially the same nodeas the second ZQ terminal 121-1. This is because a parasitic resistancevalue of an internal wiring in the control chip 120 to which an inputnode of the comparator circuit 122 is connected is sufficiently smallerthan a parasitic resistance value of the first through electrode 113. Inthe following description, therefore, those terminals mayindistinctively be referred to as a second ZQ terminal 121.

The first control circuit 114 and the second control circuit 123 receivea common input signal to operate. The input signal may be generatedwithin the control chip 120 or may be inputted from a higher-leveldevice outside of the control chip 120. If the input signal providesinstructions of a transition into a calibration mode, then the secondcontrol circuit 123 counts up with a counter until the comparisonresults of the comparator circuit 122 change. The count value of thecounter is supplied to the first control circuit 114.

When the first control circuit 114 receives the instructions of atransition into a calibration mode, it sets the impedance of the replicaoutput circuit 111 based upon the count value supplied from the secondcontrol circuit 123. Specifically, the first control circuit 114sequentially changes the impedance of the replica output circuit 111according to changes of the count value supplied from the second controlcircuit 123.

For a transition into a calibration mode, one end of an externalresistance element 130 having a predetermined resistance value (e.g.,240Ω±1%) is connected to the second ZQ terminal 121. The other end ofthe external resistance element 130 is connected to a constant voltagesource 140 operable to supply a predetermined voltage.

The comparator circuit 122 compares a voltage of the second ZQ terminal121 with a reference voltage Vref and outputs a comparison result to thesecond control circuit 123. The second ZQ terminal 121 exhibits avoltage divided by the external resistance element 130, and the firstreplica output circuit 111 and the wiring. If an output voltage of theconstant voltage source 140 and the reference voltage Vref are properlyset, then the comparison result of the comparator circuit 122 changes onthe threshold when a value obtained by adding a resistance value of thethrough electrodes to the impedance of the first replica output circuit111 is equal to the resistance value of the external resistance element130. The second control circuit 123 continues a counter operation untilthe comparison result of the comparator circuit 122 changes. When thecomparison result of the comparator circuit 122 changes, the secondcontrol circuit 123 stops the counter operation and performs certainoperations such as storing the count value in a register.

The count value stored in the register is transmitted to the firstcontrolled chip 110 and used to set the impedance of the output circuitof the first controlled chip 110. Thus, the impedance of the outputcircuit is determined depending upon the external resistance element 130and set to be a value that has considered a parasitic resistance of thethrough electrodes.

As described above, in the semiconductor device 100 of FIG. 1, theimpedance of the output circuit in the first controlled chip 110 isadjusted (calibrated) with use of the comparator circuit 122 provided inthe control chip 120. Thus, the output impedance of the first controlledchip 110 as seen from the control chip 120 includes a parasiticresistance of wiring including the through electrodes. In other words,the output impedance of the first controlled chip 110 as seen from thecontrol chip 120 becomes constant irrespective of the stacked locationof the first controlled chip 110 (wiring length to the control chip).This means that all of the controlled chips stacked on the control chip120 have the same output impedance as seen from the control chip 120.FIG. 1 does not illustrate a DQ input/output circuit (214), to which thecalibration results are actually applied. Such a DQ input/output circuitis disclosed in the drawings described later.

Preferred embodiments of the present invention will be described belowin detail with reference to the accompanying drawings.

FIG. 2 shows an example of a configuration of a semiconductor chip(controlled chip) 200 included in a semiconductor device according to afirst embodiment of the present invention. The semiconductor chip 200illustrated in FIG. 2 is a synchronous dynamic random access memory(SDRAM) chip. Nevertheless, the present invention is not limited to anSDRAM chip and is applicable to various types of semiconductor chips.

The semiconductor chip 200 includes an internal clock generator circuit201, a command decoder 202, a control circuit 203, a mode register 204,a row address buffer 205, a column address buffer and burst counter 206,a row decoder 207, a memory cell array 208, a sense amplifier 209, acolumn decoder 210, a data control circuit 211, a latch circuit 212, adelay locked loop (DLL) circuit 213, a data signal (DQ) input/outputcircuit 214, a data strobe signal (DQS) input/output circuit 215, a zeroquotient (ZQ) test circuit 216, and a ZQ adjustment circuit 217. The ZQtest circuit 216 and the ZQ adjustment circuit 217 relate to the firstreplica output circuit 111 and the first control circuit 114,respectively.

The semiconductor chip 200 also includes a plurality of externalterminals. The external terminals include a (first) ZQ terminal 218, DQterminals 219, a DQS terminal 220, and control terminals 221 forreceiving a clock signal, address signals, and command signals.

The ZQ test circuit 216 is connected to the ZQ terminal 218, which isone of the external terminals. The ZQ terminal 218 relates to the secondZQ terminal 121.

The data signal (DQ) input/output circuit 214 includes output circuits222 connected to the external terminals (DQi) for outputting internaldata from the chip and input circuits (not shown) connected to theexternal terminals (DQi) for inputting external data to the chip. TheDQS input/output circuit 215 includes an output circuit and an inputcircuit in the same manner as the data signal (DQ) input/output circuit214. Each of the output circuits 222 is connected to an impedanceadjustment circuit 223 operable to adjust the impedance of the outputcircuit 222. Similarly, in the DQS input/output circuit 215, the outputcircuit is connected to an impedance adjustment circuit.

For example, each of the output circuits 222 is formed of a plurality ofcomplementary metal oxide semiconductor (CMOS) inverters having drainsconnected in common to the external terminal (DQi). In a calibrationoperation, which will be described later, the impedance of a pluralityof CMOS inverters is adjusted with use of a resistance element providedoutside of the semiconductor device. The output circuit of the DQSinput/output circuit 215 is formed in the same manner as the outputcircuits 222 of the data signal (DQ) input/output circuit 214. Theimpedance of the output circuit of the DQS input/output circuit 215 isadjusted in the same manner as the output circuits 222. The impedance ofa group of P-channel metal oxide semiconductor (PMOS) transistors(pull-up side) of the CMOS inverters and the impedance of a group ofN-channel metal oxide semiconductor (NMOS) transistors (pull-down side)are individually adjusted in a calibration operation. A pull-up replicacircuit (indicated by 810 in FIG. 9) and a pull-down replica circuit(indicated by 820 in FIG. 9), which will be described later, correspondto the PMOS transistor group and the NMOS transistor group of the CMOSinverters, respectively. Specifically, the pull-up replica circuit (810)is formed in the same manner as the PMOS transistor group of the outputcircuit 222, and the pull-down replica circuit (820) is formed in thesame manner as the NMOS transistor group of the output circuit 222.

The ZQ test circuit 216 is used when the DQ input/output circuit 214 andthe DQS input/output circuit 215 are respectively calibrated. One DQSinput/output circuit 215 and a plurality of DQ input/output circuits 214are used as a set. If an impedance value of the output circuit of theDQS input/output circuit 215 does not match impedance values of theoutput circuits corresponding to the DQ input/output circuits 214, thena receiver in another semiconductor device to which data outputted fromthe DQ input/output circuits 214 are inputted cannot latch those datawith accuracy.

For example, a semiconductor device using the semiconductor chips 200 isformed as shown in FIG. 3.

Specifically, a semiconductor device 300 illustrated in FIG. 3 includesa logical LSI chip 310 and a plurality of semiconductor chips 200stacked on the logical LSI chip 310. In this example, 16 semiconductorchips 200 (D0-D15) are stacked on the logical LSI chip 310. The logicalLSI chip 310 is a control chip operable to control a plurality ofsemiconductor chips 200. Each of the semiconductor chips 200 is acontrolled chip controlled by the logical LSI chip 310. A control chipis a master chip (active chip), and a controlled chip is a slave chip(passive chip). The semiconductor device 300 including a master chip andslave chips has a system-in-package structure in which those chips arestacked and assembled into one package.

The semiconductor device 300 shown in FIG. 3 has a structureincorporating chip-on-chip (COC) technology and through-silicon via(TSV) technology. External terminals (not shown) of the semiconductordevice 300 shown in FIG. 3 are disposed on the logical LSI chip 310 (ata lower side in FIG. 3) via an interposer or the like. I/O signal linesformed by through electrodes (TSVs) extending through the controlledchips are connected to the logical LSI chip 310 and are not connecteddirectly to the external terminals.

FIG. 3 illustrates an example in which 16 synchronous dynamic randomaccess memory (SDRAM) chips D0-D15 with a memory capacity of 1 Gbit arestacked on the logical LSI chip 310 as a control chip.

The 16 SDRAM chips D0-D15 are grouped into a first group of the SDRAMchips D0-D7 and a second group of the SDRAM chips D8-D15. The firstgroup and the second group are selected by a first clock signal CS0CK0and a second clock signal CS1CK1 generated by the control chip (masterchip). In the following description, the first and second groups may bereferred to simply as “groups” or as “chip selection groups.”

In the illustrated example, the SDRAM chip D0 and the SDRAM chip D8 forma first DRAM set disposed closest to the logical LSI chip 310. The SDRAMchips D1 and D9 form a second DRAM set. Similarly, the SDRAM chip D6 andthe SDRAM chip D14 form a seventh DRAM set, and the SDRAM chip D7 andthe SDRAM chip D15 form an eighth DRAM set. As is apparent from FIG. 3,the SDRAM chip D15 of the eighth DRAM set is disposed farthest from thelogical LSI chip 310. The first to eighth DRAM sets achieve a datatransfer rate of 51.5 Gbytes/sec by accessing the control chip (masterchip) in parallel to each other. In the following description, the firstto eighth DRAM sets may be referred to as “sets” or “DRAM sets.”

Each of the SDRAM chips D0-D15 has the same through electrode(through-silicon via; TSV) structure, or the same pin structure.Specifically, each of the SDRAM chips D0-D15 has 382 through electrodesTSV in total, which include 256 through electrodes for data signal (DQ)transmission, 32 through electrodes for data mask (DM), 64 throughelectrodes for data strobe signals DQS/DQSB, 14 through electrodes foraddresses (A0-A13), 3 through electrodes for bank addresses (BA0-BA2), 3through electrodes for command signals (/RAS(RASB), /CAS(CASB),/WE(WEB)), and 10 through electrodes for control signals (CS0, CS1,CKE0, CKE1, CK0, CK1, /CK0, /CK1, ODT0, ODT1). As a matter of course,through electrodes for a power supply are provided in addition to theaforementioned through electrodes. Signals such as a data signal (DQ), adata mask (DM), a data strobe signal DQS/DQSB, addresses (A0-A13), bankaddresses (BA0-BA2), command signals (/RAS(RASB), /CAS(CASB), /WE(WEB)),and control signals (CS0, CS1, CKE0, CKE1, CK0, CK1, /CK0, /CK1, ODT0,ODT1) govern known DRAM functions. Signals CK0, CK1, /CK0, and /CK1 aresystem clocks used for communication between the control chip (masterchip) and the controlled chips (slave chips). Those chips aresynchronous chips.

The through electrodes TSV extending continuously through the SDRAMchips D0-D15 are referred to as continuous through electrodes.

Each of the illustrated SDRAM chips has an eight-bank configuration.Those SDRAM chips output 32-bit data signals in parallel. As describedabove, 256 through electrodes TSV for data signal (DQ) transmission areused in common by two groups (chip selection groups). In this case, eachof the DDR3 SDRAM chips usually has a transfer rate of 1,600 Mbps.Therefore, each of the SDRAM chips can achieve a data transfer rate of1,600 Mbps×32×8 DRAM sets=409.6 Gbit/sec=51.5 Gbytes/sec. Thecommunication of the first group (first controlled chip) of theaforementioned two groups (chip selection groups) is controlled with afirst access cycle by a first chip select signal outputted from thecontrol chip. The communication of the second group (second controlledchip) of the aforementioned two groups (chip selection groups) iscontrolled with a second access cycle by a second chip select signaloutputted from the control chip. The control chip controls the first andsecond groups in an exclusive manner to share the through electrodescorresponding to one I/O bit.

As indicated by solid lines in FIG. 3, each of the aforementionedcontinuous through electrodes TSV extends through all of the SDRAM chipsfrom the SDRAM chip D15 to the SDRAM chip D0. Therefore, the continuousthrough electrodes TSV of the through electrodes for data signal (DQ)transmission and the through electrodes for data strobe signals DQS/DQSBhave substantially the same length. Additionally, the continuous throughelectrodes TSV of the through electrodes for addresses, commands, andclocks have substantially the same length.

Referring to FIG. 4, the logical LSI chip 310 includes a clock generator311, a logical control circuit (controller) 313, a delay locked loop(DLL) circuit 315, an input/output circuit 317, and a VDDQ (power sourcevoltage) conversion circuit 319. The VDDQ conversion circuit 319 isoperable to supply a main power source VDDQ for operating a memory notonly to the input/output circuit 317 and the logical control circuit 313of the logical LSI chip 310, but also to the SDRAM chips D0-D15 stackedon the logical LSI chip 310.

The illustrated clock generator 311 is operable to supply a first clocksignal CS0CK0 to the SDRAM chips D0, D1, . . . , D7 shown in FIG. 2,which belong to the first controlled chip group, and also to supply asecond clock signal CS1CK1 to the second group (chip selection group) ofthe SDRAM chips D8, D9, . . . , D15, which belong to the secondcontrolled chip group. The clock generator 311 also has a function ofoutputting command signals RASB, CASB, and WEB. The signals RASB, CASB,and WEB indicate one command.

The first and second clock signals CS0CK0 and CS1CK1 are supplied toeach of the SDRAM chips D0-D15 via the through electrodes TSV forclocks. The command signals are supplied to each of the SDRAM chipsD0-D15 via the through electrodes TSV for commands. It is not necessaryto supply the first clock signal CS0CK0 to the uppermost SDRAM chip D15,which belongs to the second group (chip selection group). In thisembodiment, as indicated by a broken line, a through electrode TSV forthe first clock signal CS0CK0 extends through the uppermost SDRAM chipD15. As a result, the through electrode TSV for the first clock signalCS0CK0 has substantially the same length as the through electrode TSVfor the second clock signal CS1CK1. Specifically, the wiring of thethrough electrode for the first clock signal CS0CK0 includes a redundantwiring portion that is unnecessary to the essential connection, which ishereinafter referred to as an unnecessary redundant wiring.

The logical control circuit 313 provided in the logical LSI chip 310serves as a controller operable to output a 3-bit bank address signalBA0-2 and a 14-bit address signal A0-13 and also to receive data signalsDQ from and transmit data signals DQ to the input/output circuit 317.The logical control circuit 313 has a function similar to the functionof a DDR controller of a stub series terminated logic (SSTL) type. Thesemiconductor chip of this embodiment differs from an SSTL type chip inthat the logical LSI chip 310 having such a controller function isstacked along with the SDRAM chips D0-D15. Therefore, the logical LSIchip 310 has electrodes electrically connected to the continuous throughelectrodes provided in the SDRAM chips D0-D15.

The illustrated input/output circuit 317 is operable to receive 32-bitwidth data signals DQ from and transmit 32-bit width data signals DQ tothe SDRAM chips D0-D15 and to receive and transmit the aforementioned256-bit width parallel data signals DQ. The data signals DQ are I/O datasignals. For example, with regard to the SDRAM chip D0, a data signalline for transmitting a data signal DQ interconnects a first dataterminal 115 (indicated by 219 in FIG. 2) and a second data terminal 124corresponding to the DQ input/output circuit 214 and the input/outputcircuit 317, respectively. This holds true for the other SDRAM chips. Afirst I/O group (×32 DQ signals) is assigned to the first DRAM set, anda second I/O group (×32 DQ signals) is assigned to the second DRAM set.Third to eighth I/O groups are respectively assigned to the third toeighth DRAM sets. Those eight I/O groups access the control chip (masterchip) in parallel, so that a data transfer rate of 51.5 Gbytes/sec isachieved as described above. Specifically, a DRAM set defined by an I/Ogroup determines a data transfer rate. In other words, a DRAM setdefines the transfer band width, which indicates the number of I/Otransfer bits simultaneously communicated. As the number of the DRAMsets increases, the transfer band width is widened so that the datatransfer rate is increased. As the number of I/O bits of one I/O groupincreases, the transfer band width is widened so that the data transferrate is increased. Meanwhile, the chip selection group determines thememory capacity. As the number of chip selection groups increases, thememory capacity is increased.

The logical LSI chip 310 has a plurality of external terminals of thesemiconductor device 100 (see FIGS. 13 and 14). The DQ input/outputcircuit 214 may electrically be connected to an external device (e.g., asystem as described later, a data bus 1230, or a data input/output (I/O)bus 1320) via the external terminals of the semiconductor device 100.The second data terminal 124 may electrically be connected to anexternal device (e.g., a system as described later, a data bus 1230, ora data input/output (I/O) bus 1320) via the external terminals of thesemiconductor device 100.

In FIG. 3, therefore, it should be noted that the number of DRAM setsstacked on the logical LSI chip 310 (master chip) indicates the transferband width, and that the number of chip selection groups in each of theDRAM sets indicates the memory capacity. The logical LSI chip 310controls the controlled chips of each of the first and second sets(first and second DRAM sets) with the same access cycle so as tocommunicate information having a certain number of I/O band widths (256data signals (DQ), or x256 I/O) with the controlled chips.

The bank address signal BA0-2 and the 14-bit address signal A0-13 aresupplied to all of the SDRAM chips D0-D15 via the through electrodes foraddresses.

As is apparent from the foregoing description, the through electrodesTSV for the first and second clock signals, the through electrodes TSVfor the command signals, and the through electrodes TSV for the addresssignals have substantially the same length.

The SDRAM chip D0 (first DRAM set) and the input/output circuit 317 ofthe logical LSI chip 310 are connected to each other by 32 throughelectrodes TSV for data signals DQ as indicated as x32 (first I/Ogroup). The input/output circuit 317 has interface circuits, such asbuffers, corresponding to the SDRAM chips. Data signals DQ aretransmitted between the logical control circuit 313 and the SDRAM chipD0 via the interface circuit. The interface circuit may include aparallel-serial converter circuit in some cases. The through electrodesTSV for data signals DQ between the SDRAM chip D0 and the logical LSIchip 310 extend not only through the SDRAM chip D0, but also through theSDRAM chips D8, D1, D9, and the like, and reach the uppermost SDRAM chipD15 so as to form a continuous through electrode. This means that thethrough electrode TSV for data signals DQ in the SDRAM chip D0 includesunnecessary redundant wirings from the SDRAM chip D1 (second DRAM set)to the SDRAM chip D15 (eighth DRAM set). The through electrodes TSV fordata signals DQ in the SDRAM chip D0 is used in common by the SDRAM chipD8 (first DRAM set) as described later. In other words, the throughelectrodes TSV for data signals DQ in the SDRAM chip D0 is used incommon by the first DRAM set, which includes the SDRAM chip D0 and theSDRAM chip D8. Specifically, the logical LSI chip 310 and the SDRAM chipD0 are connected to each other by first through electrodes TSV for datasignals DQ, and the SDRAM chip D0 and the SDRAM chip D8 are connected toeach other by second through electrodes TSV for data signals DQ that areelectrically the same as the first through electrodes TSV for datasignals DQ. The aforementioned unnecessary redundant wirings relating tothe first DRAM set also extend to the other DRAM sets (second to eighthDRAM sets). However, the through electrodes TSV for data signals DQ(×32) used in the first DRAM set are redundant wiring portions that areunnecessary to the essential connection for second to eighth DRAM sets.

Similarly, through electrodes TSV for data signals DQ (second I/O group)in the SDRAM chip D1 (second DRAM set) extend from the input/outputcircuit 317 of the logical LSI chip 310 through the SDRAM chips D1 andD9 to the SDRAM chip D15. It can be seen that the through electrodes TSVfor data signals DQ in the SDRAM chip D1 also include unnecessaryredundant wirings from the second DRAM set to the eighth DRAM set.Similarly, through electrodes TSV for data signals DQ in the SDRAM chipD7 are provided between the input/output circuit 317 of the logical LSIchip 310 and the SDRAM chip D7. Through electrodes TSV for data signalsDQ in the SDRAM chip D7 are also formed of 32 through electrodes andused in common by the SDRAM chip D15. Thus, each of the throughelectrodes TSV for data signals DQ constitutes a continuous throughelectrode connecting between the logical LSI chip 310 and the uppermostSDRAM chip D15. Those through electrodes TSV for data signals DQ havesubstantially the same length.

A configuration of an SDRAM chip used in this embodiment will bedescribed along with an example of the SDRAM chip D0. In addition to theaforementioned through electrodes, the SDRAM chip D0 has a memory cell(DRAM) array 208 having a memory capacity of 2 Gbits, a command decoder202, address buffers 205 and 206, a row (X) decoder 207, a column (Y)decoder 210, a DLL circuit 213, and a DQ input/output circuit 214 asdescribed with reference to FIG. 1.

The command decoder 202 of the SDRAM chip D0, which belongs to the firstgroup (chip selection group), is operable to decode command signalsRASB, CASB, and WEB supplied from the logical LSI chip 310.

Meanwhile, the bank address signal BA0-2 and the address signal A0-A13are supplied from the logical control circuit 313 to the address buffers205 and 206. The address buffers 205 and 206 output address signalsAX0-13 and AY0-9 to the X-decoder 207 and the Y-decoder 210,respectively. When the address signals AX0-13 and AY0-9 are supplied tothe X-decoder 207 and the Y-decoder 210, the illustrated DRAM array 208performs parallel input and output of 128-bit data signals (i.e., x128)to the DQ input/output circuit 214. The input/output operation of the128-bit data signals is performed under the control of a command fromthe command decoder 202 and a clock from the DLL circuit 213.

The DQ input/output circuit 214 is operable to receive x128-bit paralleldata signals from and transmit x128-bit parallel data signals to theDRAM array 208 and also to receive 32-bit parallel data signals (×32)from and transmit 32-bit parallel data signals (×32) to the logical LSIchip 310. Specifically, the DQ input/output circuit 214 has a functionof converting x128-bit data signals into x32-bit data signals andconverting x32-bit data signals into x128-bit data signals.

With the illustrated configuration, the lengths of through electrodesTSV for data signals DQ and data strobe signals DQS/B can be madesubstantially the same in all of a plurality of DRAM sets correspondingto a plurality of I/O groups. Therefore, the skew between the datasignals DQ and the data strobe signals DQS/B can be minimized. Thisconfiguration (equal-length wiring) is very important to a structure inwhich a plurality of DRAM sets are stacked on a controller chip. This isbecause the controller chip can highly accurately control thecommunication of DQ signals (×256 DQ signals) for a plurality of I/Ogroups, each of which includes x32 DQ signals, with one synchronoussignal. Since the lengths of the through electrodes TSV for addresses,commands, and clock signals can also be made substantially the same, theskew between the address signals and the clock signals and the skewbetween the command signals and the clock signals can be minimized.

As described above, in the first embodiment of the present invention,there is provided a semiconductor device in which a control chip (thelogical LSI chip 310 in FIGS. 3 and 4) and a plurality of controlledchips (the SDRAM chips D1-D15 in FIGS. 3 and 4) are stacked with use ofTSV technology.

Now it is assumed that two controlled chips are stacked on one controlchip and are connected to the control chip via through electrodes.

For example, a first chip is defined as a control chip (master chip),and a second chip (first DRAM set) and a third chip (second DRAM set)are defined as controlled chips (slave chips). The second and thirdchips are sequentially stacked on the first chip. In such a case,communication (reading/writing) of each I/O group is conducted betweenthe first control chip and the second and third controlled chip. At thattime, the length of a signal line connecting between circuits of thefirst control chip and the second controlled chip (first impedance)differs from the length of a signal line connecting between circuits ofthe first control chip and the third controlled chip (second impedance),resulting in varied time of signal arrival and a varied amount ofreflected waves (with respect to each of the chips).

In consideration of the above, according to the first embodiment, thelength of the signal line between the first chip (control chip) and thesecond chip (controlled chip) is made equal to the length of the signalline between the first chip (control chip) and the third chip(controlled chip). Accordingly, the first impedance and the secondimpedance can be made substantially equal to each other.

Practically, it is preferable to consider a situation in which signallines formed by through electrodes may have different impedances becauseof manufacturing variations in a manufacturing process (a TSV formationprocess, a bump formation process, and a connection process of TSVs andbumps). In other words, through electrodes produced by differentmanufacturing processes may have different impedances.

It is also preferable to expect that the impedance of signal lines mayvary because of inherent manufacturing variations if a plurality ofsignal lines are formed of a plurality of through electrodes.

It is preferable to consider cases where on-die termination (ODT) inwhich a terminating resistor is connected onto each of SDRAM chipsshould be adjusted individually depending upon the aforementionedmanufacturing variations.

A calibration operation performed in a related semiconductor device willbe described below prior to explanation of the ZQ test circuit 216,which relates to the present invention in particular.

A calibration operation is performed to adjust the impedance of theoutput circuits 222 included in the DQ input/output circuit 214 and theDQS input/output circuit 215. For example, as shown in FIG. 5, the ZQtest circuit of the related semiconductor device includes an internalPMOS calibration circuit 510 and an internal NMOS calibration circuit520.

The PMOS calibration circuit 510 has a (pull-up) replica circuit 512connected between a first power source voltage (higher-potential powersource voltage VDDQ in this example; e.g., 1.5 V) and a ZQ pad 511, acomparator circuit 513 operable to compare a voltage of the ZQ pad 511with a second power source voltage (lower-potential power source voltageVSSQ in this example; e.g., 0 V), and a counter circuit (controlcircuit) 514 operable to control the impedance of the replica circuit512 in accordance with an output of the comparator circuit 513.

The ZQ pad 511 is connected to an external terminal, which correspondsto the ZQ terminal 218 of FIG. 1. When a calibration operation isperformed, an external PMOS calibration circuit 530 is connected to thatexternal terminal. The external PMOS calibration circuit 530 has anexternal resistor 531 having a predetermined resistance value (e.g.,240Ω±1%) and a constant voltage source 532 connected to an end of theexternal resistor 531 for generating a constant voltage. The externalPMOS calibration circuit 530 is a tool used during shipment inspectionby a vendor who has manufactured the semiconductor device. It should benoted that the external PMOS calibration circuit 530 is an unnecessary(absent) part at the time when the semiconductor device has been shippedand mounted on a system.

The constant voltage to be generated by the constant voltage source 532is determined such that the voltage of the ZQ pad 511 becomes 0 V whenthe impedance (on-resistance) of the replica circuit 512 is equal to theresistance value of the external resistor 531. Those conditions are thesame voltage conditions at a read-out operation (high output) in whichthe output circuit (output transistor) of the data signal (DQ)input/output circuit 214 externally outputs internal data. The internaldata mean a transition from a low level to a high level. Therefore, theconstant voltage generated by the constant voltage source 532 has thesame absolute value as the power source voltage VDDQ but has a polarityopposite to that of the power source voltage VDDQ. If the power sourcevoltage VDDQ is 1.5 V, the constant voltage generated by the constantvoltage source 532 is −1.5 V. In other words, voltage conditions betweensource terminals and drain terminals of a plurality of transistors (515)in the replica circuit 512 are the same as voltage conditions between asource terminal and a drain terminal of a first transistor connected tothe first external terminal (DQi) and included in the output circuit ofthe data signal (DQ) input/output circuit 214 that outputs high-leveldata. That voltage is a difference voltage between a first voltagecorresponding to high-level data outputted from the output transistorand a second voltage corresponding to low-level data.

The replica circuit 512 has the same configuration as a pull-up circuit(pull-up output driver) of the output circuit included in each of the DQinput/output circuit 214 and the DQS input/output circuit 215.Specifically, the replica circuit 512 has n PMOS transistors 515connected in parallel between the first power source voltage (VDDQ) andthe ZQ pad 511 and changeover switches 516 connected to gates of thosePMOS transistors 515 where n is an integer not less than 2, for examplen is 32.

Each of the changeover switches 516 is operable to supply the firstpower source voltage (VDDQ) or the voltage of the ZQ pad 511 to the gateof the corresponding PMOS transistor 515 depending upon an output(control signal PG) of the counter circuit 514. As shown in FIG. 5, whenthe first power source voltage (VDDQ) is supplied to the gate of thePMOS transistor 515 in a state in which the external PMOS calibrationcircuit 530 has been connected to the internal PMOS calibration circuit510, then the PMOS transistor 515 is brought into an off-state. When thevoltage of the ZQ pad 511 is supplied to the gate of the PMOS transistor515 in that state, then the PMOS transistor 515 is brought into anon-state. The number of PMOS transistors 515 in an on-state determinesthe impedance (on-resistance) of the replica circuit 512.

The comparator circuit 513 compares the second power source voltage(VSSQ) with the voltage developed at the ZQ pad 511 and outputs thecomparison result (a high level or a low level) to the counter circuit514.

The counter circuit 514 performs a counting operation in accordance witha clock (ICLK) while the output of the comparator circuit 513 is at ahigh level. The count value of the counter circuit 514 is transmitted asthe control signal PG to each of the changeover switches 516 forcontrolling those changeover switches 516. The changeover switches 516are controlled such that the number of PMOS transistors 515 in anon-state decreases as the count value of the counter circuit 514increases. When the number of PMOS transistors 515 in an on-statedecreases, the impedance of the replica circuit 512 increases so thatthe voltage developed at the ZQ pad 511 is lowered. Accordingly, if thevoltage of the ZQ pad 511 becomes equal to or lower than the secondpower source voltage (VSSQ), then the output of the comparator circuit513 changes into a low level, so that the counter circuit 514 stops thecounting operation. The count value of the counter circuit 514 that hasstopped the counting operation is stored as calibration information(impedance control information) in a storage portion of the ZQadjustment circuit (corresponding to 217 of FIG. 2) and is utilized toset and adjust the impedance of the pull-up circuit of the outputcircuit. The setting and adjustment of the impedance of the pull-upcircuit in the output circuit is conducted by, for example, setting andadjusting the number of transistors being activated in the pull-upcircuit.

Meanwhile, the NMOS calibration circuit 520 has a (pull-down) replicacircuit 522 connected between a first power source voltage(lower-potential power source voltage VSSQ in this example; e.g., 0 V)and a ZQ pad 521, a comparator circuit 523 operable to compare a voltageof the ZQ pad 521 with a second power source voltage (higher-potentialpower source voltage VDDQ; e.g., 1.5 V), and a counter circuit (controlcircuit) 524 operable to control the impedance of the replica circuit522 in accordance with an output of the comparator circuit 523.

The ZQ pad 521 is connected to another external terminal (not shown),which is different from the external terminal connected to the ZQ pad511. When a calibration operation (a first calibration mode) isperformed, an external NMOS calibration circuit 540 is connected to thatexternal terminal. The ZQ pad 511 may be used as the ZQ pad 521.Alternatively, the ZQ pad 521 may be connected to the external terminalconnected to the ZQ pad 511, which corresponds to the ZQ terminal 218 ofFIG. 1. In such a case, the external PMOS calibration circuit 530 andthe external NMOS calibration circuit 540 are switched in connection bya switching control (not shown) when a calibration operation isperformed. Alternatively, a selected one of the constant voltage source532 and a constant voltage source 542 may be connected to the externalresistor 531 in a switched manner.

The external NMOS calibration circuit 540 is also a tool used duringshipment inspection by a vendor who has manufactured the semiconductordevice as with the external PMOS calibration circuit 530. It should benoted that the external NMOS calibration circuit 540 is an unnecessary(absent) part at the time when the semiconductor device has been shippedand mounted on a system.

The external NMOS calibration circuit 540 has an external resistor 541having a predetermined resistance value (e.g., 240Ω±1%) and a constantvoltage source 542 connected to an end of the external resistor 541 forgenerating a constant voltage.

The constant voltage to be generated by the constant voltage source 542is determined such that the voltage of the ZQ pad 521 becomes 0 V whenthe impedance (on-resistance) of the replica circuit 522 is equal to theresistance value of the external resistor 541. Those conditions are thesame voltage conditions at a read-out operation (low output) in whichthe output circuit (output transistor) of the data signal (DQ)input/output circuit 214 externally outputs internal data. The internaldata mean a transition from a high level to a low level. Therefore, theconstant voltage generated by the constant voltage source 542 is set tobe twice the power source voltage VDDQ. When the power source voltageVDDQ is 1.5 V, the constant voltage generated by the constant voltagesource 542 is 3.0 V. Therefore, voltage conditions between sourceterminals and drain terminals of a plurality of transistors (524) in thereplica circuit 522 are the same as voltage conditions between a sourceterminal and a drain terminal of a first transistor connected to thefirst external terminal (DQi) and included in the output circuit of thedata signal (DQ) input/output circuit 214 that outputs low-level data.That voltage is a difference voltage between a first voltagecorresponding to high-level data outputted from the output transistorand a second voltage corresponding to low-level data.

The replica circuit 522 has the same configuration as a pull-downcircuit (pull-down output driver) of the output circuit included in eachof the DQ input/output circuit 214 and the DQS input/output circuit 215.Specifically, the replica circuit 522 has n NMOS transistors 525connected in parallel between the first power source voltage (VSSQ) andthe ZQ pad 521 and changeover switches 526 connected to gates of thoseNMOS transistors 525 where n is an integer not less than 2, for examplen is 32.

Each of the changeover switches 526 is operable to supply the firstpower source voltage (VSSQ) or the voltage of the ZQ pad 511 to the gateof the corresponding NMOS transistor 525 depending upon an output(control signal NG) of the counter circuit 524. As shown in FIG. 5, whenthe first power source voltage (VSSQ) is supplied to the gate of theNMOS transistor 525 in a state in which the external NMOS calibrationcircuit 540 has been connected to the internal NMOS calibration circuit520, then the NMOS transistor 525 is brought into an off-state. When thevoltage of the ZQ pad 521 is supplied to the gate of the NMOS transistor525 in that state, then the NMOS transistor 525 is brought into anon-state. The number of NMOS transistor 525 in an on-state determinesthe impedance of the replica circuit 522.

The comparator circuit 523 compares the second power source voltage(VDDQ) with the voltage developed at the ZQ pad 521 and outputs thecomparison result (a high level or a low level) to the counter circuit524.

The counter circuit 524 performs a counting operation in accordance witha clock (ICLK) while the output of the comparator circuit 523 is at ahigh level. The count value of the counter circuit 524 is transmitted asthe control signal NG to each of the changeover switches 526 forcontrolling those changeover switches 526. The changeover switches 526are controlled such that the number of NMOS transistors 525 in anon-state decreases as the count value of the counter circuit 524increases. When the number of NMOS transistors 525 in an on-statedecreases, the impedance of the replica circuit 522 decreases so thatthe voltage developed at the ZQ pad 521 is increased. Accordingly, ifthe voltage of the ZQ pad 521 exceeds the second power source voltage(VDDQ), then the output of the comparator circuit 523 changes into a lowlevel, so that the counter circuit 524 stops the counting operation. Thecount value of the counter circuit 524 that has stopped the countingoperation is stored as calibration information in a storage portion ofthe ZQ adjustment circuit (corresponding to 217 of FIG. 2) and isutilized to set and adjust the impedance of the pull-down circuit of theoutput circuit. The setting and adjustment of the impedance of thepull-down circuit of the output circuit is conducted by, for example,setting and adjusting the number of transistors being activated in thepull-down circuit.

Thus, the related semiconductor device is configured so that acalibration operation is performed in each of semiconductor chips.

However, if such semiconductor chips are stacked on a control chip asshown in FIG. 3 or 4, the impedance value indicated by calibrationinformation obtained in each of the semiconductor chips varies dependingupon the stacked location of the semiconductor chip, i.e., the wiringlength between the semiconductor chip and the logical LSI chip 310. Inother words, a semiconductor chip has a higher impedance as it islocated farther from the logical LSI chip 310. This is because it seemsto each of the semiconductor chips that the resistance value of theexternal resistance element used for a calibration operation increasesby the parasitic resistance value of the through electrodes as theexternal terminal is provided on the logical LSI chip 310. Even if acalibration operation is conducted on each single one of thesemiconductor chips, it seems to the logical LSI chip on which thesemiconductor chips have been stacked that the parasitic resistance ofthe through electrodes is added to the impedance of the output circuitof each of the semiconductor chips. Thus, it seems that a semiconductorchip located farther from the logical LSI chip has a higher impedance.

In a semiconductor device according to the present embodiment,therefore, the counters and the comparator circuits included in theinternal calibration circuits of the related semiconductor device areprovided in the logical LSI chip 310. A semiconductor device accordingto the present embodiment will be described below in detail withreference to FIG. 6.

FIG. 6 shows a semiconductor device 600 having a logical LSI chip 310and eight semiconductor chips 200 (first to eighth semiconductor chipsD0-D7) stacked on the logical LSI chip 310. Each of the semiconductorchips 200 has the configuration as described with reference to FIG. 2.FIG. 6 illustrates a portion of the internal configuration of thesemiconductor device 600 that particularly relates to the presentinvention. FIG. 6 also illustrates a portion of the internalconfiguration of the logical LSI chip 310 that particularly relates tothe present invention.

Each of the semiconductor chips 200 includes an internal circuit 610 anda through electrode circuit 620 having a plurality of through electrodes(TSVs) formed therein. The through electrodes are connected to aplurality of external terminals of the internal circuit 610. The throughelectrodes (first through electrodes) 621 in each of the chips 200 arerespectively associated with through electrodes (second throughelectrodes) in other chips. The corresponding through electrodes areconnected in a direction of stacking the chips 200. Each of the chips isconnected to the logical LSI chip by its through electrodes and thethrough electrodes of the lower chips.

Each of the through electrodes 621 has a parasitic resistance and aparasitic capacity. FIG. 6 illustrates a parasitic resistance R1 and aparasitic capacity C1 for one of the through electrodes 621.

The internal circuit 610 includes a command decoder 202, a ZQ testcircuit 216, a chip selection switch 611, and a chip selection circuit612. The chip selection switch (first or second chip selection switch)611 is connected between the ZQ test circuit 216 and a ZQ terminal(first or third ZQ terminal) 218. The ZQ terminal 218 is one of externalterminals of the internal circuit 610. The ZQ terminal 218 is connectedto the corresponding through electrode (first or second throughelectrode) 621. For example, the chip selection circuit 612 isconfigured as shown in FIG. 7.

The chip selection circuit 612 illustrated in FIG. 7 has a storageportion (RAM(0) to RAM(2)), in which identification information specificto each of the semiconductor chips 200 is stored. If informationindicated by chip select signals IO<0> to IO<2> from the logical LSIchip 310 matches the specific identification information stored in thestorage portion when a certain command MRS (mode register set) isinputted, then the chip selection circuit 612 outputs a control signalEXMRS (extended mode register set) for controlling the chip selectionswitch 611 so that the chip selection switch 611 is brought intoconduction.

For example, as shown in FIG. 8, when the command MRS and the chipselect signals IO<0> to IO<2> are supplied in common to the eightsemiconductor chips D0-D7, each of the semiconductor chips D0-D7 outputsa control signal EXMRS (pulse) in turn. Thus, each of the ZQ testcircuits 216 of the eight semiconductor chips D0-D7 is connected to thelogical LSI chip 310 in turn.

Referring to FIG. 6, the ZQ test circuit 216 has a replica outputcircuit and control circuit 613, and a calibration mode switch 614. Thereplica output circuit and control circuit 613 correspond to the firstreplica circuit and the first control circuit, or the second replicacircuit and the second control circuit. The wiring of the ZQ testcircuit 216 also has a parasitic resistance R2 and a parasitic capacityC2. The calibration mode switch 614 is brought into conduction uponentry of a calibration mode and brought out of conduction upon exit ofthe calibration mode.

The replica output circuit and control circuit 613 is configured asshown in FIG. 9. Specifically, the replica output circuit and controlcircuit 613 have a pull-up replica circuit 810, a pull-down replicacircuit 820, a 32-bit decoder 830, and a changeover switch 840. Thepull-up replica circuit 810 and the pull-down replica circuit 820correspond to the replica circuits 512 and 522 of FIG. 5, respectively.Those replica circuits 810 and 820 are both connected to the ZQ terminal218 via the chip selection switch 611. Meanwhile, the 32-bit decoder 830and the changeover switch 840 serve as a control circuit (first controlcircuit) for controlling the replica circuits 810 and 820.

Referring to FIG. 6, the logical LSI chip 310 includes a second ZQterminal 630 connected to the through electrode 621, which is connectedto the first ZQ terminal 218. As those terminals can be regarded asbeing identical, they may be referred to as the second ZQ terminal 630.

The logical LSI chip 310 has a comparison/judgment circuit 640 connectedto the second ZQ terminal 630. The logical LSI chip 310 also has acalibration mode switch 650 and a command encoder 660 for controllingthe calibration mode switch 650.

The comparison/judgment circuit 640 includes a 32-bit counter 641, acomparator circuit 642, a changeover switch 643, and a register 644. The32-bit counter 641 and the comparator circuit 642 correspond to thecounter circuit 514 and the comparator circuit 513, or the countercircuit 524 and the comparator circuit 523 of FIG. 5, respectively. The32-bit counter 641 and the register 644 serve as a second controlcircuit for performing a predetermined process in accordance with anoutput of the comparator circuit 642.

The second ZQ terminal 630 is connected to a DRAM calibration device670. The DRAM calibration device 670 has a resistance element 671 havinga predetermined resistance value (e.g., 240Ω±1%) and a constant voltagesource 672 for supplying a constant voltage. For example, the constantvoltage source 672 selectively outputs one of −1.5 V and 3.0 V.Alternatively, the constant voltage source 672 may output a singlevoltage (VDDQ/2).

Next, a calibration operation of the semiconductor device 600 shown inFIG. 6 will be described below. A calibration operation of thesemiconductor device 600 is performed as shown in FIG. 10.

First, the process enters a RON calibration setting mode (Step S901).

Specifically, both of the calibration mode switches 614 and 650 arebrought into conduction by a command to make an entry into a calibrationmode. Thus, the address pins BA0 and A0-A4 of each of the semiconductorchips 200 are connected to the replica output circuit and controlcircuit 613. Furthermore, the address pins BA0 and A0-A4 of the logicalLSI chip 310 are connected to the comparison/judgment circuit 640.

Next, one of the semiconductor chips 200 is selected (Step S902).

The selection of the semiconductor chips 200 is performed in apredetermined order. For example, one of the semiconductor chips 200 isselected from the lowermost semiconductor chip D0 to the uppermostsemiconductor chip D7. FIG. 6 shows a state in which the uppermostsemiconductor chip D7 has been selected. In the selected semiconductorchip 200, the chip selection switch 611 is brought into conduction (ON)so that the ZQ test circuit 216 is electrically connected to the ZQterminal 218.

Then a calibration operation of the pull-up replica circuit 810 (FIG. 9)is performed in the selected semiconductor chip 200 (Step S903).

Specifically, for example, the bank address signal BA0 is set to be “0”(at a low level) to switch the changeover switch 643 into thelower-potential power source voltage VSSQ. Furthermore, the changeoverswitch 840 shown in FIG. 9 is switched into the pull-up replica circuit810. At that time, an output voltage of the constant voltage source inthe DRAM calibration device 670 is set to be −1.5 V.

Subsequently, the 32-bit counter 641 is operated, and the count value issupplied as the address signals A0-A4 to the selected semiconductor chip200.

The count value changes from <A4, A3, A2, A1, A0>=<0, 0, 0, 0, 0> to<A4, A3, A2, A1, A0>=<1, 1, 1, 1, 1> by the counting-up operation of thecounter. The number of PMOS transistors being activated in the pull-upreplica circuit 810 changes according to the count value of the 32-bitcounter 641 in the same manner as described with reference to FIG. 5.Thus, the impedance of the pull-up replica circuit 810 changes. As aresult, a voltage developed at the second ZQ terminal 630 changes. Thevoltage developed at the second ZQ terminal 630 is affected by aparasitic resistance of the through electrodes from the selectedsemiconductor chip 200 to the logical LSI chip 310. Therefore, thevoltage developed at the second ZQ terminal 630 differs from a voltagedeveloped at the first ZQ terminal 218.

The comparator circuit 642 compares the voltage developed at the secondZQ terminal 630 with a reference voltage (VSSQ). If the voltagedeveloped at the second ZQ terminal 630 becomes equal to or lower thanthe reference voltage, the comparator circuit 642 changes a detectionsignal DET from a “low” level to a “high” level to stop the 32-bitcounter 641. The count value at the time when the 32-bit counter 641 hasstopped is stored in the register 644 in association with the selectedsemiconductor chip 200.

Next, a calibration operation of the pull-down replica circuit 820 isperformed in the selected semiconductor chip 200 (Step S904).

For example, the bank address signal BA0 is set to be “1” (at a highlevel) to switch the changeover switch 643 into the higher-potentialpower source voltage VDDQ. Furthermore, the changeover switch 840 shownin FIG. 9 is switched into the pull-down replica circuit 820. At thattime, an output voltage of the constant voltage source in the DRAMcalibration device 670 is set to be 3.0 V.

Subsequently, the 32-bit counter 641 is operated, and the count value issupplied as the address signals A0-A4 to the selected semiconductor chip200. The number of NMOS transistors being activated in the pull-downreplica circuit 820 changes according to the count value of the 32-bitcounter 641, and the impedance of the pull-down replica circuit 820changes. As a result, a voltage developed at the second ZQ terminal 630changes. The comparator circuit 642 compares the voltage developed atthe second ZQ terminal 630 with a reference voltage (VDDQ). If thevoltage developed at the second ZQ terminal 630 becomes equal to orlower than the reference voltage, the comparator circuit 642 changes adetection signal DET from a “low” level to a “high” level to stop the32-bit counter 641. The count value at the time when the 32-bit counter641 has stopped is stored in the register 644 in association with theselected semiconductor chip 200.

Thus, the calibration operations of the pull-up replica circuit 810 andthe pull-down replica circuit 820 are completed in the selectedsemiconductor chip 200. Then the logical LSI chip 310 determines whetheror not calibration operations have been completed for all of thesemiconductor chips 200 (Step S905). If calibration operations have notbeen completed for all of the semiconductor chips 200 (NO), then theprocess returns to Step S902 so that a next semiconductor chip 200 isselected and subjected to the aforementioned calibration operations.

If calibration operations have been completed for all of thesemiconductor chips 200 (YES at Step S905), then the process exits fromthe RON calibration setting mode (Step S906). Specifically, both of thecalibration mode switches 614 and 650 are brought out of conduction.

The count value stored in the register 644 is then transmitted to theassociated one of the semiconductor chips 200. As shown in FIG. 11, thechip selection circuit 612 outputs a control signal EXMRS, and the countvalue stored in the register 644 is supplied as address signals A0-A4 toeach of the semiconductor chips 200. Thus, each of the semiconductorchips 200 stores, as a control code for controlling the impedance of theoutput circuit, the count value associated with that semiconductor chip200 in the storage portion of the ZQ adjustment circuit 217.Alternatively, the ZQ adjustment circuit 217 may be omitted, and thecount value may be stored in a storage portion of the impedanceadjustment circuit 223 (FIG. 2). The ZQ adjustment circuit 217 transmitsthe control code stored in the storage portion to the impedanceadjustment circuit 223 in accordance with a predetermined command input.The impedance adjustment circuit 223 adjusts the impedance of the outputcircuit based upon the control code stored in the storage portion.

Transmissions of the control code from the register 644 to all of thesemiconductor chips 200 can be performed in a continuous manner as shownin FIG. 12.

As described above, in the present embodiment, the comparator circuit642 used for a calibration operation is provided in the logical LSI chip310. A calibration operation of each of the semiconductor chips 200 isperformed with use of the ZQ terminal 630 of the logical LSI chip 310.As a result, it seems to the logical LSI chip 310 that the outputimpedances of all of the semiconductor chips 200 are equal to each otherirrespective of their stacked locations. Therefore, high-speedtransmission of data can be achieved between each of the semiconductorchips 200 and the logical LSI chip 310.

In other words, in the present embodiment, a comparator circuit requiredfor a calibration operation is separated from a first controlled chipincluding a first replica output circuit with respect to a second ZQterminal of a control chip, to which an external resistance element isconnected. Therefore, the calibrated impedance of the first replicaoutput circuit ideally matches the value of the external resistanceelement. As a result, the output impedance of the first controlled chipas seen from the control chip can be matched with the resistance valueof the external resistance element.

The ZQ adjustment circuit 217 has a function of detecting thetemperature and includes a storage portion including a parameter tablefor storing the control code from the ZQ test circuit 216 in associationwith the detected temperature. The aforementioned calibration operationsare performed a plurality of times while the ambient temperature isvaried. Thus, control codes for different temperatures are obtained. TheZQ adjustment circuit 217 outputs the control code stored in the storageportion to the impedance adjustment circuit 223 in accordance with acommand from the command decoder 202. If a control code is obtained fora single temperature, the ZQ adjustment circuit 217 may be omitted.

The aforementioned semiconductor device 600 can be used in various kindsof information processing systems.

For example, as shown in FIG. 13, the semiconductor device 600 isconnected to a higher-level device 1200 by a command bus 1210, anaddress bus 1220, and a data bus 1230, so that an information processingsystem is formed.

Data outputted from each of the semiconductor chips 200 in thesemiconductor device 600 are consumed by the logical LSI chip 310, ortransmitted through the logical LSI chip 310 to the higher-level device1200, or transmitted through an intermediate output buffer of thelogical LSI chip 310 to the higher-level device 1200.

The semiconductor device 600 may also be used to form an informationprocessing system as shown in FIG. 14.

The system of FIG. 14 includes a semiconductor device 600 and ahigher-level device 1300. The semiconductor device 600 and thehigher-level device 1300 are connected to each other by a command bus1310, a data input/output (I/O) bus 1320, and an I/O replica bus 1330.

The higher-level device 1300 has a control signal generation circuit1301 and a data processing circuit 1302.

The higher-level device 1300 is operable to control the semiconductordevice 600. The higher-level device 1300 has interfaces with othercircuit (not shown) in the system and circuits outside the system and isoperable to control the entire system.

The data processing circuit 1302 of the higher-level device 1300includes output circuits. In order to adjust the impedance(on-resistance) of those output circuits, the higher-level device 1300has a ZQ test circuit 216 and a ZQ adjustment circuit 217 as with thesemiconductor device 600.

The ZQ test circuit 216 of the higher-level device 1300 is connected tothe semiconductor device 600 via a ZQ terminal and the I/O replica bus1330. Thus, a ZQ calibration operation of the ZQ test circuit 216 in thehigher-level device 1300 can also be performed with use of the DRAMcalibration device 670 connected to the semiconductor device 600.Therefore, the output impedance of the higher-level device 1300 as seenfrom the logical LSI chip 310 of the semiconductor device 600 can bemade equal to the output impedance of the semiconductor chips 200.Accordingly, a high-speed data transfer can be achieved between each ofthe semiconductor chips 200 and the higher-level device 1300.

The system as illustrated in FIG. 14 can be implemented with variouselectronic instruments such as personal computers, electroniccommunication devices, electronic products for transportations such asairplanes and automobiles, industry-oriented electronic products, andconsumer-oriented electronic products. The ZQ test circuit 216 and theZQ adjustment circuit 217 may be provided on all of the semiconductordevices of the system or on some of those semiconductor devices. Whenthe ZQ test circuit 216 and the ZQ adjustment circuit 217 are providedon all of the semiconductor devices of the system, it is possible toreduce variations of the impedance (on-resistance) between the outputcircuits of the semiconductor devices and to thus achieve improvement inprecision.

Although the present invention has been described with some embodiments,the present invention is not limited to the above embodiments. Manymodifications and variations may be made therein without departing fromthe spirit and scope of the present invention.

The technical concept of the present invention is applicable tosemiconductor devices having various functions. Furthermore,configurations of the circuits and structures of TSVs disclosed in thedrawings are not limited to those illustrated in the above embodiments.

The technical concept of a semiconductor device according to the presentinvention can be applied to various semiconductor devices. For example,the present invention is generally applicable to semiconductor productssuch as a central processing unit (CPU), a micro control unit (MCU), adigital signal processor (DSP), an application specific integratedcircuit (ASIC), an application specific standard product (ASSP), and amemory. For example, the present invention can be applied tosemiconductor devices using package-on-package (POP) technology. Thus,the present invention can be applied to semiconductor devices in anyproduct form or any package form.

Transistors used should be a field effect transistor (FET). However,various types of FETs including a metal oxide semiconductor (MOS), ametal-insulator semiconductor (MIS), and a thin film transistor (TFT)may be used for such transistors. Furthermore, the semiconductor devicemay include some bipolar transistors.

Furthermore, an N-type channel MOS transistor (NMOS transistor) is atypical example of a first conductive type of transistors, and a P-typechannel transistor (PMOS transistor) is a typical example of a secondconductive type of transistors.

The disclosed elements may be combined or selected in various wayswithin the scope of the appended claims of the present invention. Inother words, the present invention includes a variety of changes andmodifications that would be apparent to those skilled in the art fromthe entire disclosure and technical concept including the appendedclaims.

What is claimed is:
 1. A device comprising: a first controlled chip; anda control chip operable to control the first controlled chip, the firstcontrolled chip being stacked on the control chip, the first controlledchip comprising: a first output circuit, a first replica output circuithaving the same configuration as the first output circuit, a first ZQterminal electrically connected to the first replica output circuit, afirst through electrode connected to the first ZQ terminal, the firstthrough electrode extending through the first controlled chip, and afirst control circuit operable to set an impedance of the first replicaoutput circuit, the control chip comprising: a second ZQ terminalconnected to the first through electrode, a comparator circuit operableto compare a voltage of the second ZQ terminal with a reference voltage,a second control circuit operable to perform a process according to acomparison result from the comparator circuit, and a DQ input/outputcircuit operable to receive data from and transmit data to the firstoutput circuit, wherein the first control circuit and the second controlcircuit receive a common input signal to operate, adjust the impedanceof the first replica output circuit according to the comparison resultin a state in which an external resistance element is connected to thesecond ZQ terminal, and set the adjusted impedance to the first outputcircuit.
 2. The device as recited in claim 1, wherein the second controlcircuit comprises a counter operable to count a clock and supply a countvalue to the first control circuit, and the first control circuit setsthe impedance based upon the count value.
 3. The device as recited inclaim 2, wherein the second control circuit further comprises a storageportion operable to store the count value when the comparison result ofthe comparator circuit varies.
 4. The device as recited in claim 2,wherein the first controlled chip further comprises a first modechangeover switch and a second through electrode connected to the firstmode changeover switch, the second through electrode extending throughthe first controlled chip, the control chip further comprises a secondmode changeover switch connected to the second through electrode, andthe first mode changeover switch and the second mode changeover switchare brought into conduction in a calibration mode so that the countvalue is supplied via the second through electrode to the first controlcircuit.
 5. The device as recited in claim 4, wherein the second throughelectrode is used to transmit at least part of an address signal.
 6. Thedevice as recited in claim 2, wherein the first control circuitcomprises a decoder operable to decode the count value.
 7. The device asrecited in claim 6, wherein the first replica output circuit comprises apull-up replica circuit and a pull-down replica circuit, and the firstcontrol circuit further comprises a first pull-up/pull-down changeoverswitch which supplies a decode signal from the decoder selectively toone of the pull-up replica circuit and the pull-down replica circuit. 8.The device as recited in claim 7, wherein the control chip furthercomprises a second pull-up/pull-down changeover switch which selectivelysupplies one of a first voltage and a second voltage as the referencevoltage.
 9. The device as recited in claim 8, wherein the firstpull-up/pull-down changeover switch and the second pull-up/pull-downchangeover switch are controlled in common.
 10. The device as recited inclaim 1, wherein the first controlled chip further comprises: a firstchip selection switch connected between the first replica output circuitand the first ZQ terminal, and a first chip selection circuit operableto control the first chip selection switch.
 11. The device as recited inclaim 10, further comprising a second controlled chip stacked with thefirst controlled chip, wherein the second controlled chip comprises: asecond output circuit, a second replica output circuit having the sameconfiguration as the second output circuit, a third ZQ terminalelectrically connected to the second replica output circuit, a secondthrough electrode connected to the third ZQ terminal and connected tothe first through electrode, the second through electrode extendingthrough the second controlled chip, and a third control circuit operableto set an impedance of the second replica output circuit, and whereinthe DQ input/output circuit receives data from and transmits to thesecond output circuit, and the first control circuit and the thirdcontrol circuit receive the common input signal to operate, adjust theimpedance of the second replica output circuit according to thecomparison result in a state in which the external resistance element isconnected to the second ZQ terminal, and set the adjusted impedance tothe second output circuit.
 12. The device as recited in claim 11,wherein the second controlled chip further comprises: a second chipselection switch connected between the second replica output circuit andthe third ZQ terminal, and a second chip selection circuit operable tocontrol the second chip selection switch.
 13. An information processingsystem comprising: the semiconductor device as recited in claim 1; andanother semiconductor device connected to the semiconductor device by abus.
 14. A device comprising on a single chip: a first external ZQterminal which is provided for connecting to an external resistanceelement when a calibration mode is performed; a second external ZQterminal; a through electrode provided between the first and secondexternal ZQ terminals to electrically connect the first external ZQterminal to the second external ZQ terminal; an external addressterminal receiving an address signal; a decoder configured to decode theaddress signal to produce a decoded signal; a replica circuit includinga impedance path between a power source node and a ZQ node, theimpedance path including a changeable impedance value based on thedecoded signal; a first switch circuit provided between the externaladdress terminal and the decoder to apply the address signal to thedecoder when the calibration mode is performed; and a second switchcircuit provided between the second external ZQ terminal and the ZQ nodeto electrically connect the second external ZQ terminal and the ZQ nodewhen the calibration mode is performed.
 15. A device comprising on asingle chip: a first external ZQ terminal which is provided forconnecting to an external resistance element for performing acalibration mode; a second external ZQ terminal which is provided forconnecting to an external device; a first node electrically providedbetween the first and second external ZQ terminals; an external addressterminal configured to output an address signal; a comparisondetermination circuit configured to compare a voltage on the node and areference voltage to produce an information and output the informationto a second node when the calibration mode is performed; and a switchcircuit provided between the external address terminal and the secondnode to transfer the information from the second node to the externaladdress terminal when the calibration mode is performed.